US semiconductor equipment is cold, shipments are low

Release on : Apr 27, 2019

SEMI (International Semiconductor Industry Association) announced the latest North American semiconductor equipment shipment report. In March, equipment manufacturers shipped $1,832.4 million, a 28-month low.

Equipment industry analysts, as DRAM and NAND Flash prices are still bearish, the memory factory's capital expenditure plan is cautious and conservative this year, and the new factory installation time of the foundry is delayed until the second half of the year, which caused the equipment shipments in March to be more than two years. The reason for the new low.

 

According to SEMI statistics, North American semiconductor equipment manufacturers shipped $1,832.4 million in March this year, down 1.9% from February's $1,868.1 million, down 24.6% from $2,311.8 million in March last year, and since December 2016. The 28-month low. SEMI Global Marketing Director and President of Taiwan, Cao Shilun said that although the sales of test and packaging equipment in March were slightly improved compared with last month, it is expected that the sales growth of North American equipment manufacturers will maintain a low level this year. .

In the first quarter of this year, the semiconductor market was in a downturn. The wafer foundry declined in the first quarter. Although the second quarter, the number of films increased, including the top five wafers such as TSMC, UMC, Samsung Foundry, Gexin, and SMIC. The foundry has been significantly conservative in the expansion of new capacity this year, and the expansion of existing process capacity has slowed down. For TSMC and Samsung, this year's major investment is focused on the construction of extreme ultraviolet (EUV) and 5 nanometer production lines.

In addition, the memory factory's investment this year has been significantly reduced. As the price of DRAM and NAND Flash fell sharply in the first quarter, the second quarter continued to bearish, and the decline is likely to continue into the second half. In order to reduce the price decline, Samsung, SK Hynix, Micron, South Asia Branch, Toshiba and other memory factories have reduced the scale of capital expenditure this year, and delayed the original expansion plan.

According to SEMI's announcement of the global fab forecast report at the end of last year, it is estimated that the investment amount in 2019 will be 8% lower than that in 2018. The memory giants Samsung and SK Hynix slashed capital expenditure, which caused the global fab spending to decline this year. The key is important. As for China's fab equipment investment this year has been revised down to about 12 billion US dollars, due to poor market conditions, the US-China trade war led to tensions between the two countries, and the uncertainty of the environment led to delays in building plans.

However, the semiconductor market is expected to recover in the second half of the year, the end of the smart phone inventory and the start of new chips, artificial intelligence, high-performance computing, 5G and other new application chips need to adopt advanced processes, the amount of film will be obvious in the second half of the year. Growth, memory demand will also enter the peak season. The industry expects North American equipment shipments to be flat or slightly higher in the second quarter than in the first quarter. In the second half of the year, it will see a large increase. In 2020, equipment shipments are expected to return to 2018.